A report by The Information claims that the world’s biggest chipmaker is considering adding memory back into its portfolio, starting with next-generation 3D DRAM.
With demand still outpacing supply and prices sky-high, the outlet says it could compete with memory giants Micron, Samsung, and SK Hynix to develop and produce 3D DRAM technology that stacks chips vertically for increased bandwidth, capacity, and power efficiency.
[Link: TSMC Weighs Making Advanced Memory Chips to Capture More AI Spending | https://www.theinformation.com/articles/tsmc-weighs-making-advanced-memory-chips-capture-ai-spending?rc=v4bmzs | The Information]
It takes an already-existing memory manufacturer 4–5 years to do a new factory.
I don’t know how much longer it’d take a non-memory manufacturer, but presumably more.
I’m not saying that this would be bad, but I’d expect that it’d be some way in the future if it happens.
If anyone can pull this off in a shorter timeframe it’s TSMC. But that’s very ambitious even for them, of course.